PCB Design Associate (Fixed Tenure)

JOBID: ENGG/RRDTP/2022/003

INTRODUCTION

We are opening applications for Remote Research & Development Trainee Program, 2022 for Skilled Individuals with vision and drive to build Life-Altering Technology and gain invaluable experience in Technology Development.

Young Enthusiastic and Outlier-Bright Engineers to develop their careers and build lvlAlpha current product Platform.

Experienced Candidates out of Job Cycle and with Gaps can also apply to kickstart their careers.

We expect Resume, Cover Letter, Reference Letters, Case Studies and Self Assessment forms for every successful Candidate, incomplete applications will be NOT considered for further evaluation. Please mentioned JOBID along with your application.

Please send the all documents to [email protected]

SUMMARY

Designation : PCB Design Associate (Fixed Tenure)
Functional Area : System Architecture System Design and Engineering
Location : Remote Acceptable
Tenure : 6 Months (Fixed Tenure)
Skills : Allegro, Orcad, HDI PCB, RF, BoM, PDN, Components
Qualification : UG/PG with specialisation in Electronics and Electrical Engineering, Computer Science, or specialised related fields.
Functional Area : Wearables, IoT Systems, Mil-Grade Tech, Electronic Systems
Compensation : Upto USD1k CTC Annually

RESPONSIBILITIES

• Be part of a team which conceives, designs, develops, and tests Product Prototype and Proof of Concept systems.
• Develop chipset architecture via exhaustive technical analyses to meet the product requirements of the target platform wearable and hearable devices, and optimize for Chipset Cost, Power Distribution Network, PCB Area, eBOM, Signal Integrity and Power metrics
• Be responsible for System level end-to-end use case analyses to propose innovative solutions and architectural changes to existing and new platforms.
• Be responsible for Chipset level analyses that influence product decisions right from the concept phase.
• Be Responsible for delivering the Power Grid design, PMIC requirements, Chipset level Clocking and Interface requirements for a chipset.
• Be responsible for developing new Designs and/or enhancing existing product/prototype designs.
• Interact, understand and support Engineering requirements with Fabricators, Integrators, Manufacturers and Vendors related to Product development.
• Work closely with Product Management, Hardware and Software architecture, Systems teams, Customer Engineering with Device Packaging, PCB, Components and PCB design support.
• Documentation and presentation of analyses and results to core teams and management.

SKILLS

• RESystem level architecture, Hardware engineering or related fields preferably in the areas of low power mobile platforms such as Wearable IoT platforms.
• Strong analytical skills and familiarity with top-down engineering design.
• Must be capable of converting high-level product requirements to architecture trade-offs and design parameters, to meet KPIs of cost, power, performance, board area etc.
• Self-driven, Innovative and able to influence decisions based on data-driven analyses
• Strong communication skills, and able to coordinate across multiple teams globally.
• Good knowledge on aspects impacting Power and its distribution.
• Good knowledge of 2 or more mobile inter-chip interfaces (USB, PCIe, SD/eMMC, UFS, LPDDRx, CSI, DSI, SPI/I2C/SPMI/Slimbus etc.)
• Good domain knowledge of 2 or more functional areas of Mobile SoCs such as Application Processor, Display, Camera, Video, Graphics, Wireless Communication, Power Management etc.
• Experience in Validating Power/performance at a system level on boards is a plus
• Experience in chipset partitioning analysis, PDN analysis, or high-speed interface signal integrity/power integrity analysis and architecture is a plus.
• Experience in defining/designing Power distribution strategies, Power regulator requirements, System Power use case analyses is a plus
• Experience in defining/designing Clocking methodologies/schemes is a plus
• Experience in System thermal analysis is a plus
• Layout Using Allegro and Orcad Capture for schematics
• Altium and Pad are optional.
• Knowledge on PCB Footprints
• Designed Complex High-Speed Layouts.
• Experience on HDI PCB Layouts
• MANDATORY Knowledge of RF, Onboard Antenna and Wireless devices Footprint.

REQUIREMENTS

• Previous experience in Tech Product based Startups and Core-Engineering Companies, preferred.
• Previous experience in Wearables, IoT Device, Medical Devices, Diagnostic Systems, MIL-Grade Electronics, preferred.
• Willingness to learn new Skills, Self-Manageable and Motivated to succeed.