Lead structured failure analysis and root-cause investigations across silicon photonics, MEMS, optical packaging, bonded assemblies, and PCBAs.
Perform and interpret cross-sections of bonded structures and material interfaces, identifying defects, intermetallic formation, diffusion, cracking, voiding, contamination, delamination, and other failure mechanisms.
Design precision mechanical components and assemblies supporting silicon photonic devices
Develop mechanical packaging, modules,and enclosures, including mounting structures and fiber management solutions for high-performance optical systems
Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.
Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces.
