Jobs at SkyWater Technology

• Provide technical guidance to technicians and engineers
• Technical expert for cooling systems (chillers, glycol chillers, cooling towers, process cooling water, water treatment)

• Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools.

• Define the engineering vision and multi-year technology roadmaps aligned with corporate growth, yield scaling, and profitability goals.
• Lead and mentor a multi-disciplinary team of engineering managers and individual contributors.

Bold Thinking. World Changing.

• Serve as process module owner for Back End of Line (BEOL) metrology tools.
• Lead root-cause analysis investigations of signal shifts on metrology equipment using data driven approach.

• Develop, integrate, and qualify wafer processes across diffusion, films, litho, etch, and CMP areas.
• Create and own wafer process flows using combination of automated recipes and custom work instructions (RSCs)

• Serve as an internal and external customer-facing quality representative, working directly with customers to address inquiries, requests, excursions, complaints, and quality concerns.
• Build strong customer relationships through responsive communication, technical expertise, and timely issue resolution.

• Lead the engineering team through clear goals, strong performance management, coaching, development, and succession planning.
• Build and strengthen technical capability through knowledge sharing, development planning, and meaningful delegation.

• Define and refine a vision for the engineering team to create a purposefully driven, highly-effecitve team
• Build effective teams to solve complex problems

• Perform routine checks and monitor process performance using Statistical Process Control (SPC) charts.
• Assist in the qualification and validation of new processes or equipment.

• Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).

• Will be technical R&D leader/expert to develop, integrate and re-optimize robust manufacturable processes to meet customer specifications for Diffusion and LPCVD applications.
• Perform experiments and data analysis to qualify process changes and troubleshoot integration issues.

• Customer System & Technical Discovery
• Serve as the primary technical interface during early customer engagements and proposal shaping.

• This individual will own all issues and their resolutions as well as continuous improvement. Will investigate WET issues by finding root cause using statistical methods and electrical analysis. Engineer investigates shifts in WET parameters using statistical methods.
• Will collaborate improvements with Fab process engineers and other product engineers who are re...

• Manage the Wafer Inspection and Defect Density team for the Austin site, which is responsible for operations and applications, line health monitoring, and baseline defect improvement.
• Lead a team of engineers, section managers, operators and technicians.

• Perform routine checks and monitor process performance using Statistical Process Control (SPC) charts.
• Assist in the qualification and validation of new processes or equipment.

• Technological Roadmap: Define and drive the advanced packaging technology roadmap in partnership with the CTO, aligning with business objectives and market trends. Translate strategy into execution through integrated process and equipment development, ensuring clear linkage to measurable business outcomes. Own the enterprise vision, scope, and direction for Module Engineering (process and equipment).

• Develop comprehensive process flows for wafer manufacturing, ensuring seamless execution.
• Collaborate with CAD engineers to validate incoming layout files, constructing frames with essential metrology boxes and electrical test structures.

• Develop comprehensive process flows for wafer manufacturing, ensuring seamless execution.
• Collaborate with CAD engineers to validate incoming layout files, constructing frames with essential metrology boxes and electrical test structures.

• Test Development: Collaborate with the design and product engineering teams to develop test methodologies and test plans for CMOS devices, SRAM, and analog/digital products. Design and implement automated test programs and hardware setups using industry-standard test equipment.
• Characterization: Conduct electrical characterization of CMOS integrated circuits to analyze th...