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Ultrathin microelectronic packaging for the Internet of Things1-10 Employees
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Ultrathin microelectronic packaging for the Internet of Things
Terecircuits' electronic packaging and assembly technology makes integrated multichip circuits with unprecedented thinness, flexibility, compactness and performance, yet at low cost.

It uniquely enables the vision of pervasive electronics inherent in the Internet of Things.

Wearable products can be more attractive, more “wearable”, without losing functionality; smart home products can meld into the interior designer's décor without change; large numbers of industrial sensors can fit into one machine and provide input to Big Data analytics to predict failure before it happens. Agricultural soil sensors can be sown with the seeds. Mobile phones can have more sensors in a thinner case.

The many different “things” in the IoT have many different electronic requirements; they need more and faster innovation than a single chip can satisfy. Terecircuits makes it possible.

Our product is electronic circuits which meet the needs of customers in the mobile, connected era.
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Jayna Sheats
Avatar for Jayna Sheats
Founder @Intelleflex, @Terepac • Worked at @Hewlett-Packard, @Nanosolar • Studied at @Stanford University
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