Jobs at Semtech

• Build and lead the SPP Fab Quality organization across both fabrication facilities
• Recruit, develop, and manage quality inspectors while building future technician and quality engineering capabilities

• 3rd or 4th year Engineering student who is eligible for a 16-month co-op/internship position
• Enrolled in either Electrical, Electronics, Engineering Physics, or related degree program

• Actively participate in the product development teams throughout the NPI cycle.
• Contribute to ongoing product verification and manufacturing by supporting ATE Test activities.

• Develop technical skills and product knowledge under technical mentorship and guidance from senior engineers.
• Learn and follow New Product Introduction (NPI) processes and procedures, assisting senior engineers in maintaining documentation compliance.

• Depending on the candidate’s strengths and interests, responsibilities may include any of the following areas of focus:
• Perform package design feasibility assessments for the signal integrity experts, in conjunction with the manufacturing and thermo-mechanical engineering teams.

• Reproduce customer-reported issues in the lab and perform root cause analysis with guidance from senior engineers, communicating clear findings and next steps.
• Create technical customer collateral, including test reports, application notes, and input for data sheets and design guides.

• Manage the corrective and preventive action process, records, and status reporting for the site
• Lead CARs using 8D and structured root cause analysis (5-Why, fishbone, fault tree), partnering with engineering and manufacturing on failure analysis and effective corrective actions

• Administer and maintain NetApp (ONTAP) and Pure Storage arrays across multiple global sites provisioning, capacity planning, performance tuning, firmware/OS upgrades.(30%)
• Manage and monitor Druva backup jobs, retention policies, and restore operations; troubleshoot backup failures and validate recovery point/time objectives (20%)

• Analyzing requirements and translating them into reliable software designs
• Implementing and testing features across the ALMS stack·

• Design and build statistical and algorithmic detection tools for wafer probe data — including test hardware integrity checks, software bin/yield outlier detection, parametric drift analysis, and reticle- and wafer-level spatial pattern classification — leveraging Semtech's existing statistical infrastructure (20%)

• Design and Development: Propose and implement innovative solutions for customers particularly in mechanical, electrical, software integration and algorithm development; develop and build proof-of-concept demos and prototypes; perform electrical design, PCB layout & fabrication, and electrical component souring; conduct debugging and hardware bring-up of solutions of targeted applications; support R&D test & evaluation board design & fabrication; manage PCB vendors.

• Conduct testing, measurement, and troubleshooting of advanced high-speed signal integrity devices using high-speed laboratory equipment such as BERTs, VNAs, WFMs, and oscilloscopes.
• Support the applications team by performing lab measurements and preparing shipments for customer samples.

• Analyze new product functional requirements to determine required data structures and behaviors
• Work with the design and system teams to help devise algorithms for various applications.

• As the Intern, High Speed Analog IC Design, you will be involved with:

The design, development, verification and characterization of analog and mixed-signal circuits for use in our data communications products.
Circuits such as phase-locked loops, equalizers, optical and cable receivers and drivers plus other key circuit building blocks. State-of-the-art BiCMOS and CMOS technologies are used for these circuits.
Advanced CAD tools for the design, layout, simulation, and verification of the analog blocks plus scripting work for IC design and validation automation using Python, Skill, TCL, etc.
Semtech’s dynamic team environment and senior designers who will provide mentoring and guidance throughout the internship term.

• Architect and define test strategies for complex mixed-signal products from concept through production maturity
• Lead development of innovative test methodologies sensing products

• (40%) Product Definition for Next-generation High-Speed IC Products
• (25%) Optical Component and System Ecosystem Engagement

• Lead resolution of FiberEdge customer returns and RMAs, including technical communication, containment, 8D reporting, and production support, collaborating with cross-functional teams (50%).
• Drive NCMR/Quality Excursion resolutions in partnership with Supply Quality Engineering and subcontractors, ensuring corrective actions are effective and sustainable (20%).

• Pre-sales technical engagement to drive revenue generation goals consistent with quota. Revenue generated through Large Direct Customers, Solutions Providers, Distributors, or Systems Integrators.
• Provide Sierra Wireless technical training to partners specific to our MVNO IoT connectivity and cloud management offerings.

• Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
• Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity — including crosstalk, impedance control, and return-loss optimization.

• Support IT Engineering, IT Support and EDA teams on network related topics
• Maintain our actual infrastructure (Patching, devices lifecycle,…)